KALYAN RAPOLU, MS, PH.D., principal engineer at the DuPont Silicon Valley Technology Center, has more than 10 years of experience in R&D and applications development of PCB and IC packaging materials for RF and signal integrity for consumer electronics and telecom industries. His expertise includes RF design, signal/power integrity simulation and analysis, prototyping, and characterization of high-speed digital circuits. Prior to DuPont, he worked as a senior process engineer at Applied Materials. He holds a Master’s and Ph.D. degree in Electrical Engineering from Villanova University.
Associated Program(s)
Embedded Systems
